Surface Mount Assembly has become our mainstay of business at B W Electronics utilizing our modern Surface Mount Process. A great deal of products quoted on these days are surface mount, but still very often found are a the combination with conventional through hole components too.
- Prototype, Low or Medium Volume Assembly.
- Full anti-static precautions
- AOI ability for Pre and post Reflow
- Surface mount placement by manual or automatic pick and place.
- Components size: from 0402 to 35 mm sq. (Up to 10mm sq. using on-board camera); max height 10.5mm; minimum lead pitch 0.5mm
- Components range: Chip, Melf, Mini-melf, cylindrical components, transistors, SOT diodes, integrated circuits, PLCC and LCCC integrated circuits, trimmers, inductors, connectors, aluminium electrolytic capacitors. BGA, LGA and QFN placement.
- Hot air reflow